1. General specification 基本事項(xiàng) 1.1 Switch action :                                          Push-on type S. P. S. T 開關(guān)種類 :                                                輕觸開關(guān) 1.2 Switch rating 最大額定值 :                              D. C. 12V , 50 mA 1.3 Operation temperature range 使用溫度試驗(yàn)范圍 :            - 30~ + 85ºC 1.4 Preservative temperature range 保存溫度范圍 :              - 40~ + 85ºC 1.5 Appearance and dimensions :                              See outside drawing page 外形及尺寸 :                                              見外形尺寸圖 1.6 Standard condition Unless otherwise specified, the test and measurements shall be 試驗(yàn)、 測(cè)定狀態(tài)       carried out as follows: Ambient temperature 溫度:                                  5 ~ 35ºC Ｒelative humidity 相對(duì)濕度:                                45 ～ 85％ Air pressure 氣 壓:                                        86 ～ 106kPa(860～1060mbar) However, if doubt arises on the decision based on the measured Values under the above-mentioned conditions, the following conditions shall be employed: 但是在對(duì)判定產(chǎn)生疑義時(shí),按下述狀態(tài)實(shí)施: Ambient temperature 溫 度:                                20±2ºC Relative humidity 相對(duì)濕度:                                65±5％ Air pressure 氣 壓:                                       86 ～ 106kPa(860～1060mbar) 2. Performance 性能 2.1 Electrical characteristics 電氣性能 No. Item 項(xiàng)目 Test condition 試驗(yàn) 條 件 Performance 規(guī)格 2.1.1 Contact resistance 接觸電阻 Push force: (Operation force) x 2。 測(cè)定時(shí)的負(fù)荷：操作方向動(dòng)作力基準(zhǔn)值的2 倍。 Measurement tool : Contact resistance meter 測(cè)定器：微電流接觸電阻計(jì)(1kHz, 20mV, 5～50mA)   50mΩ MAX 50mΩ 以下 2.1.2 Insulation resistance 絕緣電阻 D. C. 100V(Between terminals) (端子間) 100MΩ min 100MΩ 以上 2.1.3 Withstand voltage 耐電壓 A. C 500V for 1 min (Between terminals) (端子間) No. insulation destruction. 無(wú)絕緣破壞 2.1.4 Bouncing 觸點(diǎn)抖動(dòng) Operation speed : 3～4 times/s 操作速度： 每秒3～4 次   Switch Bouncing Test Circuit 抖動(dòng)測(cè)定回路       ON:3ms max 以下 OFF:8ms max以下
2.2 Mechanical Characteristics 機(jī)械性能 No. Item 項(xiàng)目 Test condition 試 驗(yàn) 條 件 Performance 規(guī)格 2.2.1 Operation force 動(dòng)作力 Push by recommended operating condition.(4.2) 按規(guī)定的操作條件施加壓力(4.2)   Push force 按壓力 200gf±50gf return force 回彈力 0.5N min (50gf min) 2.2.2 Travel to closure 動(dòng)作行程 Push by recommended operating condition.(4.2) F=(Operation force ) x2 按規(guī)定的操作條件施加壓力 F=動(dòng)作力x2   0.25±0.01mm 2.2.3 Push strength 按壓強(qiáng)度 50N(5Kgf)for 1 minute 50N(5Kgf) 1 分鐘 No damage Electricalandmechanical 無(wú)異常   電氣、機(jī)械性能 2.2.4 Pull strength 推壓強(qiáng)度 Break by drawing push plate in the direction of right diagram 抽拔推桿使其破壞的強(qiáng)度.   20N min (2kgf min) 2.2.5 Vibration test 耐振性 (1) Amplitude 全振幅: 1.5 mm (2) Sweep rate: 10-55-10HZ for 1 minute 掃描速度: 10-55-10HZ 1 分鐘 (3) Sweep method: Logarithmic frequency sweeprate 掃描方式: 對(duì)數(shù)頻率掃描速度 (4) Vibration direction : X, Y, Z( 3 directions ) 振動(dòng)方向: X,Y, Z (3 方向) (5) Time : Each direction 2 hours (Total 6hours) 時(shí)間: 每個(gè)方向2 個(gè)小時(shí)(共6 個(gè)小時(shí))     No.2.1 and 2.2.1 to 2.2.2 shall be satisfied 滿足 2.1 項(xiàng)和2.2.1 至 2.2.2 項(xiàng). 2.2.6 Soldering heat test 耐焊接熱 Soldering area: t/2 of P.W.B. thickness (P.W.B:T=1.6) 焊接面積：印刷基板的1/2 厚度處 Soldering temperature : 260± 5℃ 焊接溫度：260± 5℃ soldering time : 5 ±1 sec. 焊接時(shí)間：5 ±1 秒   No damage (electrical andmechanical) 無(wú)異常。 (電氣、機(jī)械特性） 2.2.7 Solderbility 可悍性 After sprated flux 涂上助焊劑后 temperature :230± 5℃ 溫度：230± 5℃ soldering time :2±0.5 sec 焊接時(shí)間：2±0.5 秒 70% or more of surface area of the portion immersed in solder shall be covered by new solder 70% 或更多的浸焊面積能 被焊錫覆蓋.
2.3 Climatic characteristics 耐候性能 No. Item 項(xiàng)目 Test condition 試驗(yàn) 條 件 Performance 規(guī)格 2. 3. 1 Cold test 耐寒性 (1) Temperature : - 40±2℃ 溫度：- 40±2℃ (2) Duration of test: 96h 持續(xù)時(shí)間：96 小時(shí) (3) Take off a drop water 去掉水珠 (4) Standard conditions after test : 1h 試驗(yàn)后的放置條件：1 小時(shí) Contact resistance 200mΩ max No. 2.1.2 to 2.1.4 and No. 2.2.1 to 2.2.2 shall Be satisfied 接觸電阻 200mΩ以下 滿足2.1.2 到2.1.4 項(xiàng)、2.2.1到2.2.2 項(xiàng). 2.3.2 Heat test 耐熱性 (1) Temperature : 85±2℃ 溫度： 85±2℃ (2) Duration of test: 96h 持續(xù)時(shí)間：96 小時(shí) (3) Standard conditions after test : 1h 試驗(yàn)后的放置條件：1 小時(shí) Contact resistance 200mΩmax No. 2.1.2 to 2.1.4 and No. 2.2.1 to 2.2.2 shall Be satisfied 接觸電阻 200mΩ以下 滿足2.1.2 到2.1.4 項(xiàng)2.2.1到2.2.2 項(xiàng). 2. 3. 3 Temperature cycle 溫度循環(huán) (1) Test cycles :20 cycles 試驗(yàn)周期：20 個(gè)周期 (2) Standard condition after test :1h 試驗(yàn)后的放置條件：1 小時(shí)   temperature 溫度 duration of test 持續(xù)時(shí)間 1 cycle 一次 循環(huán) 20±5℃ 1h -40±2℃ 1h 20±5℃ 1h 85±5℃ 1h   No damage Electricalandmechanical 無(wú)異常   電氣、機(jī)械性能 2.3.4 Humidity test 耐濕性 (1) Temperature : 60±2℃ 溫度：60±2℃ (2) relative humidity: 90~95% 相對(duì)溫度:90~95% (3) Duration of test: 96h 持續(xù)時(shí)間：96 小時(shí) (3) Take off a drop water 去掉水珠 (5) Standard conditions after test : 1h 試驗(yàn)后的放置條件：1 小時(shí) Contact resistance 200mΩ max No. 2.1.2 to 2.1.4 and No. 2.2.1 to 2.2.2 shall Be satisfied 接觸電阻 200mΩ以下 滿足2.1.2 到2.1.4 項(xiàng)、2.2.1 到2.2.2 項(xiàng). 2.3.5 Salt mist 鹽霧實(shí)驗(yàn) The switch shall be subjusted to a fime mist of salt solution at a temperature of 35±2℃ for 12H continuously (salt solution concentration 5±1% by weight) 溫度: 35±2℃ 濃度: 5±1% 時(shí)間: 24H Without excessive rust Contact resistance 200mΩ max
No. Item 項(xiàng)目 Test condition 試驗(yàn) 條 件 Performance 規(guī)格 2. 3. 6 Endurance (switching) action) 耐久特性 （開關(guān)壽命） (1) D.C.12V 50mA resistance load D.C 12V 50mA 電阻負(fù)荷 (2) Operation speed : 2~3 times / s 動(dòng)作速度：2~3 次/ 秒 (3) Push force : Maximum value of operation force 按力: 動(dòng)作力規(guī)格值的上限 (4) Operation number:50,000 times 動(dòng)作次數(shù): 5萬(wàn) Contact resistance 200mΩ max 接觸電阻 200mΩ以下 Bouncing: 10 ms max 觸點(diǎn)抖動(dòng): 10 秒以下 Variation rate of operation force shall be within ±30%to the value before testing 動(dòng)作力的變化范圍在初始值的±30%以內(nèi) No.2.1.2 and 2.2.2 shall Be satisfied 滿足2.1.2 和2.2.2 項(xiàng) 2. 3. 7 Withstand H2S 耐H2S (1) Density : 3±1ppm 濃 度 :3±1ppm (2) Temperature : 40±2ºC 溫度 : 40±2ºC (3) Relative humidity : 90~95% 相對(duì)濕度: 90~95% (4) Duration of test : 12h 持續(xù)時(shí)間: 12 小時(shí) (5) Standard conditions after test : 1h 試驗(yàn)后的放置條件:1 小時(shí) Contact resistance 200mΩ max No. 2.1.2 to 2.1.4 and No. 2.2.1 to 2.2.2 shall be satisfied 接觸電阻 200mΩ以下 滿足2.1.2 到2.1.4 項(xiàng)、2.2.1 到2.2.2 項(xiàng). 2.3.8 Withstand SO2 耐SO2 (1) Density : 10±2ppm 濃 度 :10±2ppm (2) Temperature : 40±2ºC 溫度 : 40±2ºC (3) Relative humidity : 90~95% 相對(duì)濕度: 90~95% (4) Duration of test : 12h 持續(xù)時(shí)間: 12 小時(shí) (5) Standard conditions after test : 1h 試驗(yàn)后的放置條件:1 小時(shí) Contact resistance 200mΩ max No. 2.1.2 to 2.1.4 and No. 2.2.1 to 2.2.2 shall Be satisfied 接觸電阻 200mΩ以下 滿足2.1.2 到2.1.4 項(xiàng)、2.2.1 到2.2.2 項(xiàng). 2.3.9 Shock 耐沖擊性 Measure after test at a condition below 在下列條件下進(jìn)行測(cè)試后的量度 Peak acceleration----80G 沖擊加速度-80G Test time-6direction ,each 3 times total 18times 測(cè)試次數(shù)-6 個(gè)方向，各3 次共計(jì)18 次。   No.2.1 and 2.2.1 to 2.2.2 shall be satisfied 第2.1 及2.2.1—2.2.2 都應(yīng)符合要求
4. Precaution注意事項(xiàng) 4.1 Soldering condition 浸焊條件 ITEM 項(xiàng)目 CONDITION 條件 Preheat temperature 預(yù)熱溫度 110ºC max (Embilomental temperature of soldering surface of P. W. E) 110ºC 以下(印刷基板焊錫面周圍的溫度) Preheat time 預(yù)熱時(shí)間 60 sec, max 60 秒以內(nèi) Area of flux 助焊劑的面積 1/2 max of P. W. B. thickness 印刷基板厚度的1/2 以內(nèi) Temperature of solder 焊錫溫度 255ºC max 255ºC 以下 Time of immersion 浸焊時(shí)間 Within 5 sec 5 秒以內(nèi) Soldering number 浸焊次數(shù) Within 2 times (But should bring down heat of the first soldering) 2 次以內(nèi) (但應(yīng)把第一次焊錫的溫度降下來(lái)) Printed wiring board 印刷基板 Single sided copper-clad laminates 單面銅箔 (1) After switches were soldered, please be careful not to clean switches with solvent 開關(guān)浸焊后,注意不要用溶劑清洗. (2) In the case of using soldering iron, soldering conditions shall be 280ºC max and 3 sec. max 在使用鉻鐵的情況下,焊錫溫度應(yīng)在280ºC 以下、3 秒以內(nèi). (3) Right after switches were soldered; please be careful not to load on the knobs of switches. 浸焊后,注意不要在頂部施加負(fù)荷. 4. 2 Design instructions(設(shè)計(jì)中應(yīng)注意的事項(xiàng)) (1) Follow recommended P. W. B. piercing plan in outside drawing page. 印刷基板的安裝孔尺寸參見產(chǎn)品圖. (2) Design key top as fig –1. Design inclination of key top 4 deg. max as fig -2. (Recommended operating condition.) 擊鍵部設(shè)計(jì)如圖 –1,擊鍵部?jī)A斜度如圖 –2 在4 度以內(nèi). (參見操作條件). 4.3 Note(注意點(diǎn)) (1) Please be cautious not to give excessive static load or shock to switches. 注意不要施加超負(fù)荷的壓力或晃動(dòng)開關(guān). (2) Please be careful not to pile up P. W. B. after switches were soldered. 開關(guān)焊接以后,印刷基板注意不要疊放. (3) Preservation under high temperature and high humidity or corrosive gas should be avoided especially. When you need to preserve for a long period, do not open the carton. 保管時(shí)尤其應(yīng)注意避開高濕高溫和有腐蝕性氣體的環(huán)境.如需長(zhǎng)時(shí)間保存,請(qǐng)不要打開包裝箱. (4) Panasert RH and RH6 shall be used as the standard insert machine (use N type clinch). 使用標(biāo)準(zhǔn)插入機(jī)器PANASERT 和RH6（使用N 式釘） (5) Preservation under high temperature and high humidity or corrosive gas should be avoided especially, when you need to preserve for a long period, do not open the carton. 特別注意避免將產(chǎn)品保存在高溫、強(qiáng)溫度或有腐蝕性氣體的地方。若長(zhǎng)期保存，請(qǐng)勿打開包裝箱。
編   制	吳  華		daizhangdl.cn
審   核	鄭  濤		簽字		日期	2021.02.2

?返回列表